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2/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 output voltage variable type figure 1. typical application circuits output voltage variable type output voltage fixed type figure 2. typical application circuits output voltage fixed type htsop-j8 f igure 3. pin configuration pin no. pin name pin function 1 out output pin 2 fb /n.c. feedback pin (bd00fc0wefj) no connection (bdxxfc0wefj) 3 gnd gnd pin 4 n.c. no connection (connect to gnd or leave open) 5 en enable pin 6 n.c. no connection (connect to gnd or leave open) 7 n.c. no connection (connect to gnd or leave open) 8 v cc input pin reverse gnd substrate(connect to gnd) n.c. pin can be open, because it is not connected to the ic. vcc en gnd fb out c in vcc r 2 r 1 vcc en gnd out c out c in vcc fb/ n.c. n.c 8 7 6 5 1 2 3 4 out gnd en n.c n.c vcc c out
3/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd00fc0wefj (output voltage variable type) figure 4. block diagrams bd00fc0wefj (output voltage variable type) bdxxfc0wefj (output voltage fixed type) figure 5. block diagrams bdxxfc0wefj (output voltage fixed type) 5 8 ocp vref tsd driver 1 2 3 en vcc out fb : : thermal shut down circuit : power transistor driver vref ocp tsd driver : bandgap reference gnd over current protection circuit 5 8 ocp vref tsd driver 1 3 en vcc gnd out : : thermal shut down circuit : power transistor driver vref ocp tsd driver : bandgap reference over current protection circuit
4/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 parameter symbol ratings unit supply voltage 1 vcc -0.3 to +35.0 v en voltage 2 v en -0.3 to +35.0 v power dissipation pd 2110 3 mw operating temperature range topr -25 to +85 storage temperature range tstg -55 to +150 maximum junction temperature tjmax 150 1 do not exceed pd. 2 the order of starting up power supply (vcc) and en pin does not have a problem, provided that they are operated within the power supply voltage range. 3 reduced by 16.9mw/ for temperature above 25 . (when mounted on a two-layer glass epoxy board 70mm 70mm 1.6mm dimension) note : this product is not designed for protection against radioactive rays. Q QQ Q Q QQ Q parameter symbol min max. unit supply voltage (v out R 3.0v) vcc v out +1 26.5 v supply voltage (v out <3.0v) vcc 4.0 26.5 v startup voltage (i out =0ma) vcc - 3.8 v en voltage v en 0 26.5 v output current i out 0 1.0 a output voltage 4 (bd00fc0wefj) v out 1.0 15.0 v 4 please refer to notes when using bd00fc0wefj at output voltage of 1.0v to 3.0v. unless otherwise specified, ta=25 , vcc=13.5v, i out =0ma, v en =5.0v the resistor between fb and out =56.7k , fb and gnd =10k (bd00fc0wefj) parameter symbol guaranteed limit unit conditions min. typ. max. circuit current at shutdown mode i sd - 0 5 a circuit current icc - 0.5 2.5 ma output reference voltage (bd00fc0wefj) v fb 0.742 0.750 0.758 v i out =50ma output voltage v ou t v out 0.99 v out v out 1.01 v i out =500ma minimum dropout voltage vco - 0.3 0.5 v vcc= v out 0.95, i out =500ma line regulation reg.i - 20 80 mv v out +1.0v 26.5v load regulation reg.i out - v out 0.010 v out 0.020 v i out =5ma 1a en high voltage v en (high) 2.0 v active mode en low voltage v en (low) 0.8 v off mode en bias current i en 25 50 a
5/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd00fc0wefj series (5.0v output setting) unless otherwise specified, ta=25 , vcc=13.5v, v en =5.0v, i out =0ma, v out =5.0v (the resistor between fb and out =56.7k , fb and gnd =10k ) figure 6. circuit current (i feedback_r P 75a) figure 7. shutdown current figure 8. line regulation (i out =0ma) figure 9. line regulation (i out =500ma) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 circuit current:icc+i feedback_r [ma] supply voltage:vcc [v] ta =25 0 3 6 9 12 15 18 0 2 4 6 8 10 12 14 16 18 20 22 24 26 shutdown current:i sd [ a] supply voltage:vcc [v] ta =25 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:v out [v] supply voltage:vcc [v] ta =25 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:v out [v] supply voltage:vcc [v] ta =25
6/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 10. load regulation figure 11. dropout voltage (vcc=4.75v) (l out =0ma 1000ma) figure 12. ripple rejection (i out =100ma) figure 13. output voltage temperature characteristic 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 ripple rejection:r.r. [db] frequency: f [hz] ta =25 0 1 2 3 4 5 6 -40 -20 0 20 40 60 80 100 120 output voltage: v out [v] ambient temperature: [ ] 0 1 2 3 4 5 6 0 400 800 1200 1600 2000 2400 output voltage:v out [v] output current:i out [ma] ta =25 0 100 200 300 400 500 600 700 800 900 1,000 0 200 400 600 800 1000 dropout voltage : vco[mv] output current:i out [ma] ta =25
7/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 16. en voltage vs output voltage figure 17. thermal shutdown circuit characteristic 0 20 40 60 80 100 120 140 160 0 2 4 6 8 10 12 14 16 18 20 22 24 26 en bias current:i en [ a] enable voltage: v en [v] ta =25 0 1 2 3 4 5 6 0 2 4 6 8 10 12 14 16 18 20 22 24 26 output voltage:v out [v] enable voltage: v en [v] ta =25 0 1 2 3 4 5 6 130 140 150 160 170 180 190 output voltage:v out [v] ambient temperature:ta [ ] 0.0 0.2 0.4 0.6 0.8 1.0 0 200 400 600 800 1000 circuit current:icc+i feedback_r [ma] output current:i out [ma] ta =25 figure 14. circuit current (i out =0ma 1000 ma) (ifeedback_r P 75a) figure 15. en voltage vs en current
8/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bd00fc0wefj series 5.0v output setting measurement setup for figure 6 measurement setup for figure 7 measurement setup for figure 8 measurement setup for figure 9 measurement setup for figure 10 measurement setup for figure 11 measurement setup for figure 12 measurement setup for figure 13 measurement setup for figure 14 measurement setup for figure 15 measurement setup for figure 16 measurement setup for figure 17 5 v vcc en gnd fb out 1f feedba ck _ r 56 .7 k 10 k 1 f vcc en gnd fb out 1f 56 .7 k 10 k 1f 5 v vcc en gnd fb out 1 f 1f 56.7k 10k 5v vcc en gnd fb out 1f 1 f 56 . 7k 10 k 500 ma 5v vcc en gnd fb out 1f 1 f 56 .7k 10 k 13 .5v 5 v vcc en gnd fb out 1f 1 f 56 .7k 10 k 4 . 75 v 5v vcc en gnd fb out 1f 1f 56 . 7k 10k 13 .5v 1 vrms 100ma 5v vcc en gnd fb out 1f 1 f 56 .7k 10 k 13 .5v feedback _ r 5v vcc en gnd fb out t 1f 1f 56 .7k 10k 13.5v vcc en gnd fb out 1 f 1f 56 .7k 10 k 13.5 v vcc en gnd fb out 1f 1f 56 . 7 k 10 k 13.5v vcc en gnd fb out 1f 1 f 56 .7k 10 k 13 .5v 5v
9/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 vcc gnd vcc gnd ? applying positive surge to the vcc pin if there is a possibility that surges higher than 35.0v will be applied to the vcc pin, a zener diode should be placed between the vcc pin and gnd pin, as shown in the figure below. ? applying negative surge to the vcc pin if there is a possibility that negative surges lower than the gnd are applied to the vcc pin, a schottky diode should be place between the vcc pin and gnd pin, as shown in the figure below. ? implementing a protection diode if there is a possibility that a large inductive load is connected to the output pin resulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. figure 18. figure 19. figure 20.
10/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 htsop-j8 as the power consumption increases above the maximum allowable power dissipation of the chip, the temperature across the chip also increases. when considering thermal design for the regulator, operation should be maintained within the following conditions: 1. ambient temperature ta can be not higher than 85 . 2. chip junction temperature (tj) can be not higher than 150 . chip junction temperature can be determined as follows: most of the heat loss that occurs in the bdxxfc0wefj series is generated from the output pch fet. power loss is determined by the voltage drop across v cc -out and the output current. be sure to confirm the system?s input and output voltages, as well as the output current conditions in relation to the power dissipation characteristics of the v cc and v out in the design. bearing in mind that the power dissipation may vary substantially depending on the pcb employed, it is important to consider pcb size based on thermal design and power dissipation characteristics of the chip with the pcb. power consumption [w] = input voltage (v cc ) - output voltage (v out ) i out (average) example: where v cc =5.0v, v out =3.3v, i out (average) = 0.1a, power consumption [w] = 5.0v - 3.3v 0.1a =0.17w c alculation based on ambient temperature (ta) tj=ta+ j-a w reference values 1-layer pcb (copper foil density 0mm 0mm) 2-layer pcb (copper foil density 15mm 15mm) 2-layer pcb (copper foil density 70mm 70mm) 4-layer pcb (copper foil density 70mm 70mm) pcb size: 70mm 70mm 1.6mm (pcb with thermal via) j-a: htsop-j8 153.2 /w 113.6 /w 59.2 /w 33.3 /w measurement condition: mounted on a rohm board pcb size: 70mm 70mm 1.6mm (pcb with thermal via) ? solder the thermal pad to ground ic only j-a=249.5 /w 1-layer copper foil : 0mm 0mm j-a=153.2 /w 2-layer copper foil : 15mm 15mm j-a=113.6 /w 2-layer copper foil : 70mm 70mm j-a=59.2 /w 4-layer copper foil : 70mm 70mm j-a=33.3 /w power dissipation :pd [w] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 ?? :ta [ ] 1.0 0.50w 0.82w 1.10w 2.11w 3.76w ambient temperature: ta [ ]
11/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 please connect resistors r 1 and r 2 (which determines the output voltage) as shown in figure 22. please be aware that the offset, due to the current that flows from the fb terminal, becomes large when resistors with large values are used. resistance values ranging from r 2 =5k to 10k is recommended. v out setting equation is, v out P v fb (r 1 +r 2 )/r 2 thoroughly check the constant settings on the application because circuit current increases depending on connected resistor. resistance value of r 2 is from 5k to 10k . determine r 1 by adjusting with r 2 . figure 22. en terminal vcc terminal v out terminal
12/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 1. absolute maximum ratings use of the ic in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the ic. assumptions should not be made regarding the state of the ic (e.g., short mode or open mode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the ic. 2. electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits, and other conditions. therefore, be sure to check all relevant factors, including transient characteristics. 3. gnd potential the potential of the gnd pin must be the minimum potential in the system in all operating conditions. ensure that no pins are at a voltage below the gnd at any time, regardless of transient characteristics. 4. ground wiring pattern when using both small-signal and large-current gnd traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. also, ensure that the gnd traces of external components do not cause variations on gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. inter-pin shorts and mounting errors use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply or gnd pins (caused by poor soldering or foreign objects) may result in damage to the ic. 6. operation in strong electromagnetic fields using this product in strong electromagnetic fields may cause ic malfunction. caution should be exercised in applications where strong electromagnetic fields may be present. 7. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 8. power dissipation pd using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including reduced current capability due to the rise of chip temperature. the mentioned power dissipation in the absolute maximum rating of this specification, at htsop-j8 package when 70mm 70mm 1.6mm glass epoxy board is mounted, is the value of when there is no heat dissipation board. and in case this exceeds, take the measures like enlarge the size of board; make copper foil area for heat dissipation big; and use dissipation board and do not exceed the power dissipation. 9. thermal consideration use a thermal design that allows for a sufficient margin in light of the pd in actual operating conditions. consider pc that does not exceed pd in actual operating conditions. (pd R pc) tjmax : maximum junction temperature=150( ) , ta : peripheral temperature( ) , ja : thermal resistance of package-ambience( /w), pd : package power dissipation (w), pc : power consumption (w), vcc : input voltage, v out : output voltage, i out : load, icc : circut current package power dissipation : pd (w) = (tjmax-ta) / ja power consumption : pc (w) = (vcc-v out )i out +vccicc
13/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 10. vcc pin insert a capacitor (v out R 5.0v:capacitor R 1f, 1.0 Q v out 5.0v:capacitor R 2.2f) between the vcc and gnd pins. choose the capacitance according to the line between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the application. verify the application and allow for sufficient margins in the design. it is recommended to use a capacitor with excellent voltage and temperature characteristics. 11. output pin in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend a capacitor with a capacitance of more than 1 f(3.0v Q v out Q 15.0v). electrolytic, tantalum and ceramic capacitors can be used. we recommend a capacitor with a capacitance of more than 4.7 f(1.0v Q v out <3.0v). ceramic capacitors can be used. when selecting the capacitor, ensure that the capacitance of more than 1 f(3.0v Q v out Q 15.0v) or more than 4.7 f(1.0v Q v out <3.0v) is maintained at the intended applied voltage and temperature range. due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor, refer to the cout_esr vs i out data. the stable operation range given in the reference data is based on the standalone ic and resistive load. for actual applications, the stable operating range is influenced by the pcb impedance, input supply impedance, and load impedance. therefore, verification of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend using x5r, x7r, or better, with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets the required specification. electric capacitor ceramic capacitor, low esr capacitor ic cin vs cout (reference data) cout_esr vs i out (reference data) cin vs cout (reference data) 4.0v Q v cc Q 2 6.5v 3.0v Q v out Q 1 5 .0 v -25 Q ta Q +85 5k Q r 2 Q 10k (bd00fc0wefj) cin=2.2f Q cin Q 100f 1f Q cout Q 100f cout_esr vs i out (reference data) 4.0v Q v cc Q 26.5v 1.0v Q v out <1.5v -25 Q ta Q +85 5k Q r 2 Q 10k (bd00fc0wefj) 2.2f Q cin Q 100f 4.7f Q cout Q 100f 4.0v Q v cc Q 26.5v 3.0v Q v out Q 1 5 .0 v -25 Q ta Q +85 0a Q i out Q 1a 5k Q r 2 Q 10k (bd00fc0wefj) 1 10 100 1 10 100 cout(f) cin f stable operating region 6.0v Q v cc Q 26.5v 5.0v Q v out Q 1 5 .0 v -25 Q ta Q +85 0a Q i out Q 1a 5k Q r 2 Q 10k (bd00fc0wefj) 4.0v Q v cc Q 26.5v 1.0v Q v out <3.0v -25 Q ta Q +85 0a Q i out Q 1a 5k Q r 2 Q 10k (bd00fc0wefj) 4.0v Q v cc Q 26.5v 1.5v Q v out <3.0v -25 Q ta Q +85 5k Q r 2 Q 10k (bd00fc0wefj) 2.2f Q cin Q 100f 4.7f Q cout Q 100f 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) c o u t _ e s r ( stable operating region unstable operating region 0.5 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) c o u t _ e s r ( stable operating region unstable operating region 2.2 1 10 100 1 10 100 cout f cin f stable operating region 2.2 unstable operating region stable operating region 4.7 1 10 100 1 10 100 cout f cin f stable operating region unstable operating region 0.001 0.01 0.1 1 10 100 0 200 400 600 800 1000 io(ma) c o u t _ e s r ( unstable operating region stable operating region i out ( ma) i out ( ma) i out ( ma)
14/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operation note 11 measurement circuit (bd00fc0wefj) 12. en pin do not make the voltage level of the chip?s enable pin at floating level or in between v en (high) and v en (low). otherwise, the output voltage would be unstable or indefinite. 13. for a steep change of the vcc voltage because mosfet for output transistor is used when an input voltage change is very steep, it may evoke large current. when selecting the value of external circuit constants, please make sure that the operation on the actual application takes these conditions into account. 14. for infinitesimal fluctuations of output voltage. for applications that have infinitesimal fluctuations of the output voltage caused by some factors (e.g. disturbance noise, input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert a filter, etc.). 15. over current protection circuit (ocp) the ic incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity. this circuit serves to protect the ic from damage when the load becomes shorted. it is also designed to limit output current (without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continuous or transitive operation of the protection circuits. 16. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn the ic off, completely, in the event of thermal overload. it is not designed to protect the ic from damage or guarantee its operation. ic?s should not be used after this function has activated, or in applications where the operation of this circuit is assumed. 17. in some applications, the vcc and the vout potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. for example, the accumulated charge in the output pin capacitor flow backward from the vout to the vcc when the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f for reducing the damage. we also recommend using reverse polarity diodes in series between the vcc and the gnd or a bypass diode between the vout and the vcc.
15/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 18. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. pn junctions are formed at the intersection of these p layers with the n layers of other elements, creating parasitic diodes and/or transistors. for example (refer to the figure below): when gnd > pin a and gnd > pin b, the pn junction operates as a parasitic diode when gnd > pin b, the pn junction operates as a parasitic transistor parasitic diodes occur inevitably in the structure of the ic, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. example of simple monolithic ic architecture parasitic elements (pin a) parasitic elements or transistors (pin b) c b e n p n n p+ p+ parasitic elements or transistors p substrate (pin b) c b e transistor (npn) (pin a) n p n n p+ p+ parasitic elements p gnd gnd gnd n resistor
16/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 s (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 2 3 4 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 ( ) direction of feed reel 1pin htsop-j8 (top view) x x f c 0 w part number marking lot number 1pin mark
17/17 datasheet bdxxfc0wefj series tsz02201-0r6r0a600480-1-2 ? 2013 rohm co., ltd. all rights reserved. 2013.08.27 rev.001 www.rohm.com tsz22111 ? 15 ? 001 date revision changes 27.aug.2013 001 new release
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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